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Heat dissipation material Product List

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[Series Volume 4] Thermal Design Consultant Naoki Kunimine's Column

[Series Volume 4] Thermal Design Consultant Naoki Kunimine's Column

<Currently available for free> From my position, having been involved in thermal design for many years, I would like to share my thoughts on thermal design.

Written by Mr. Naoki Kunimine, President of Thermal Design Lab Inc. This is a column material reflecting on 45 years of involvement in thermal design, titled "Miscellaneous Stories of Thermal Design." Due to the positive feedback from readers, we are releasing the fourth installment of the column. 【Content (Excerpt)】 The author first heard the term "thermal design" over 40 years ago. In the fourth installment, I will share my views on the "true goal" of utilizing thermal fluid simulation. ■ How to eliminate individual differences in analysis modeling ■ How to improve the accuracy of input data for analysis ■ The goal of simulation is not "agreement with actual measurements" *For more details, please refer to the PDF material or feel free to contact us.

  • Other electronic parts
  • Heat dissipation material

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[Seminar] Thermal Management and Heat Dissipation Design Addressing Both Mechanical Design and Circuit Design

[Seminar] Thermal Management and Heat Dissipation Design Addressing Both Mechanical Design and Circuit Design

Transform "thermal issues" into "design quality." Master thermal management for electronic devices from the basics to practical applications in one day!

In recent years, with the miniaturization and high performance of electronic devices, "heat" has become a critical issue that affects product performance and reliability. This seminar is aimed at hardware development designers and project managers who are troubled by issues such as "components generating more heat than expected" and "frequent failures due to heat." It will systematically explain the fundamentals of thermal design and thermal countermeasures for electronic devices, from basic principles to practical applications. We will introduce foundational knowledge such as the three principles of heat, specific countermeasures at the circuit and board levels, appropriate selection methods for thermal interface materials (TIM), and how to utilize thermal simulations, all presented in an easy-to-understand manner with a wealth of failure case studies. Take this opportunity to learn the key points of thermal design and acquire the skills to solve problems in the early stages of product development. We look forward to your participation.

  • Technical Seminar
  • Other contract services
  • Heat dissipation material

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TE-7127 for industrial robots

TE-7127 for industrial robots

Achieves both high thermal conductivity and ease of use. Contributes to the performance improvement of industrial robots.

In the industrial robot industry, temperature management of electronic components is crucial for achieving high-precision movements. Particularly for components that generate significant heat, such as high-output motors and control boards, efficient heat dissipation is required. Poor heat dissipation performance can lead to component failure or performance degradation, potentially resulting in a decrease in the overall precision of the robot. TE-7127 addresses these challenges with its high thermal conductivity, contributing to the reliability of industrial robots. 【Application Scenarios】 - Heat dissipation for high-output motors - Sealing of control boards - Protection of precision sensors 【Benefits of Implementation】 - Extended lifespan of components - Improved operational stability of robots - Achievement of high-precision tasks

  • Other polymer materials
  • Other consumables
  • Heat dissipation material

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